Potting Compound for Aluminum Substrate HN-8808 Series - Excellent Adhesion, No Delamination
Product Overview for Silicone Potting Compound:
Specifically formulated to address the challenges of potting on aluminum substrates, the HN-8808 series delivers exceptional adhesion to aluminum and other metals. This prevents the common failure mode of delamination under thermal cycling, ensuring long-term reliability by maintaining a critical path for heat transfer from components to the heat sink. It is the optimal choice for power modules, LED boards, and any application where a strong, durable bond to aluminum is essential for performance.
Key Performance Parameters for Silicone Potting Compound:
* Adhesion to Aluminum: Excellent (Validated by cross-cut test and thermal cycling)
* Mix Ratio (A:B): 10 : 1 (by weight)
* Thermal Conductivity: 0.5±0.1 W/M·K (Black/White) - ensures efficient heat transfer
* Coefficient of Thermal Expansion: Matches well with metals, reducing stress.
* Hardness (Shore A): 30-40 - Elastic enough to absorb CTE mismatch stress.
* Temperature Range: -50°C ~ 200°C - Withstands operating temperatures of high-power modules.
Product Highlights for Silicone Potting Compound:
* Superior Adhesion to Aluminum: Engineered formula creates a strong, permanent bond, eliminating delamination concerns.
* Reliable Thermal Path: Maintains intimate contact with the substrate, ensuring consistent thermal performance over the product's life.
* Resists Thermal Cycling: Withstands repeated temperature swings without cracking or pulling away from the substrate.
* Corrosion Protection: Protects the aluminum substrate from oxidation and corrosion.
* Comprehensive Seal: Provides a complete environmental seal around components mounted on the metal core board.
Application Areas for Silicone Potting Compound:
* High-power LED modules on MCPCBs (Metal Core PCBs)
* Automotive power controllers (e.g., LED headlight drivers)
* Power conversion modules (e.g., DC-DC converters)
* Industrial motor drives
* Any electronic assembly potted directly into an aluminum housing
Detailed Operating Guide for Silicone Potting Compound:
1. Substrate Cleaning: This is critical. Clean the aluminum surface with isopropyl alcohol or a specialized cleaner to remove all oxides, oils, and contaminants. Abrasive cleaning may be beneficial for best adhesion.
2. Primer (Optional): For the most demanding applications or with specific aluminum alloys, a primer can be used to enhance adhesion. Consult us for recommendations.
3. Standard Mixing & Potting: Follow the standard HN-8808 process: stir A, weigh 10:1, mix thoroughly, degas, and pot.
4. Curing Under Mild Pressure: If possible, apply slight pressure during cure (e.g., by clamping the lid) to further promote adhesion.
5. Post-Cure Handling: Allow the module to fully cure for 7 days before subjecting it to extreme thermal cycling tests.
Key Precautions for Silicone Potting Compound:
* Surface Preparation is Key: Poor cleaning is the primary cause of adhesion failure. Do not skip or rush this step.
* Check Compatibility: Ensure any solder mask or silkscreen on the aluminum substrate is compatible.
* Avoid Contamination: Do not touch the cleaned surface with bare hands.
* Do Not Heat Cure: Adhesion will be severely compromised if heat is applied during cure.
Packaging & Storage for Silicone Potting Compound:
* Standard Packaging: 22kg/set (20kg A + 2kg B); 11kg/set (10kg A + 1kg B).
* Storage Conditions: Store in a cool, dry place in sealed containers.
* Shelf Life: 6 months in original, unopened containers from date of manufacture.
FAQ for Silicone Potting Compound:
1. Q: How do you test and guarantee adhesion to aluminum?
A: We use standardized cross-cut tests (ASTM D3359) and thermal shock cycling (e.g., -40°C to 125°C) to validate adhesion. Our products consistently achieve excellent ratings.
2. Q: Does it adhere to other metals like copper or steel?
A: Yes, it exhibits very good adhesion to copper, brass, and stainless steel as well. Always test with your specific material.
3. Q: What is the maximum operating temperature for the bond to aluminum?
A: The adhesive bond remains stable across the entire service temperature range of -50°C to 200°C.
4. Q: Can you provide a technical data sheet with detailed adhesion values?
A: Yes, we can provide a TDS with lap-shear or peel strength data upon request.
5. Q: Our product undergoes 1000+ thermal cycles. Will it delaminate?
A: Our HN-8808 series is specifically formulated to pass such rigorous tests. We recommend you perform a qualification test on your specific module, and we are confident in the result.
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Potting Compound for Aluminum Substrate HN-8808 Series - Excellent Adhesion, No Delamination Images
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