Thermally Conductive Silicone Potting Compound HN-8806 | ≥0.76 W/m·K for Power Electronics Cooling
Product Overview for silicone potting compound:
Your expert in thermal management. HN-8806 is specifically designed for heat dissipation, with a thermal conductivity of ≥0.76 W/m·K. It effectively reduces the operating temperature of power devices, enhancing reliability and lifespan. While maintaining high electrical insulation, it is the ideal choice for cooling power electronics.
Key Features for silicone potting compound:
Efficient Thermal Conductivity (≥0.76 W/m·K) | High Insulation | Long-Term Thermal Stability | Low CTE | Non-Bleeding.
Technical Parameters:
Thermal Conductivity: ≥0.76 W/m·K
Coefficient of Thermal Expansion (CTE): 210 μm/(m·°C)
Volume Resistivity: 1.0×10¹⁶ Ω·cm
Operating Temperature Range: -50°C ~ +250°C
Hardness (Shore A): 45±5
Product Applications for silicone potting compound:
Power Modules:Direct potting for IGBTs, MOSFETs, diodes, and other power devices.
LED Drivers:Thermal management and protection for high-power LED outdoor drive power supplies.
New Energy:Photovoltaic inverter power sections, energy storage system PCS units.
Industrial Drives:Inverter and servo drive power sections for heat dissipation and insulation.
Usage Instructions for silicone potting compound:
1. Preparation:Ensure heat-generating components and heat sink surfaces are clean for optimal thermal transfer.
2. Mixing & Deaeration:Mix thoroughly and vacuum degas, as air bubbles are poor thermal conductors.
3. Potting:Ensure the compound fully envelops the heat source and contacts the cooling surface.
4. Curing:Cure at room temperature or with heat as required.
Important Notes for silicone potting compound:
Optimal thermal performance depends on bubble-free potting and good contact.
Packaging & Storage for silicone potting compound:
Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.
Store in a cool, dry place. Shelf life: 6 months.
FAQ for silicone potting compound:
Q: What level is 0.76 W/m·K?
A: It is a medium-high level for potting compounds, suitable for most power electronics, effectively reducing hot-spot temperatures.
Q: Are thermal conductivity and electrical insulation contradictory?
A: No, this product is designed for electronics, balancing both thermal and electrical performance.
Q: How to achieve the best cooling effect?
A: Ensure full contact between the compound, heat source, and housing, with no air bubbles.
Q: Does it bleed silicone oil?
A: No, it cures into a stable elastomer with no risk of silicone oil separation.
Q: Do you have higher conductivity grades?
A: Yes, for requirements >1.5 W/m·K, please contact us for advanced grades.
Product Tags:
|
|
Thermally Conductive Silicone Potting Compound HN-8806 | ≥0.76 W/m·K for Power Electronics Cooling Images
|
