25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue
Product description:
HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.
Two-component, it cures on its own after being mixed at room temperature.
Product application:
10:1 potting compound, with its convenient mix ratio, is widely used for protecting electronic assemblies. Its typical applications include automotive control modules, LED drivers, power supplies, and industrial inverters. It provides excellent thermal stability, moisture resistance, and electrical insulation for components that require robust, long-term performance in demanding environments.
Technical Parameters
| № | Itrems | Technique Request |
| 1 | Appearance | Transparent, White, Black
Flowing Liquid |
| 2 | Viscosity (before curing) (mPa.S) | A:2000 B:50 |
| 3 | Specific Gravity (23℃) | 0.98 |
| 4 | Available Time (h, 25℃) | 1-2h |
| 5 | Entirely Cure Time (h, 25℃) | 8-12h |
| 6 | Shaw Hardness (JIS A) | 25A |
| 7 | Volume Resistivity (Ω cm) | ≥1×1014 |
| 8 | Strength of Breakdown Voltage (kv / mm) | 18-25 |
| 9 | Dielectric Constant (1MHZ) | 2.5 - 3.0 |
| 10 | Dielectric Loss Angle Tangent (1MHZ) | ≤4×10-3 |
| 11 | Thermal Conductivity (w / m.k) | 0.1 - 0.20 |
How to use:
According to the dosage, pour it into the mold after mixing according to A: B=10:1.
Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).
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25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue Images
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